描述
ICP RIE Cluster Tool, 3-chamber. Includes: 1ea control cabinet w/ PDUs/control computers; 2ea control cabinets w/ PDUs, Leybold Mag Drive 1000 controller, MKS 600-series pressure controller; 5ea ENI ACG-10B RF generators; 2ea ENI VL-400 phase shift controller; 3ea ENI Genesis-series RF generators; 5ea Leybold MAG 1500 turbopumps; 2ea Leybold MAG 900 turbopumps; 1ea Brooks transfer robot; 2ea Thermo Neslab Merlin M75 recirculating chillers; 1ea Neslab CFT-75 recirculating chiller; 3ea Ebara ESR20N vacuum pump; 1ea Ebara A25S vacuum pump.配置
無配置OEM 代工型號說明
STS Multiplex is a type of etcher that offers a large range of materials etching possibility such as insulators (SiO2, Si3N4 and SiC), silicon, metals (Al Alloys, Pt, Ti) and some polymers. It is dedicated for etching metals (processes under chlorine chemistry), quartz (fluorine/carbonate chemistry) and polyimide (oxygen chemistry). STS offers a range of different platform options, each compatible with all STS process technologies. The Multiplex has a single process chamber with manually loaded vacuum loadlock and carousel wafer handler for 2-4 wafers.文檔
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STS
MULTIPLEX
類別
Dry / Plasma Etch
上次驗證: 18 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
149252
晶圓尺寸:
6"/150mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ICP RIE Cluster Tool, 3-chamber. Includes: 1ea control cabinet w/ PDUs/control computers; 2ea control cabinets w/ PDUs, Leybold Mag Drive 1000 controller, MKS 600-series pressure controller; 5ea ENI ACG-10B RF generators; 2ea ENI VL-400 phase shift controller; 3ea ENI Genesis-series RF generators; 5ea Leybold MAG 1500 turbopumps; 2ea Leybold MAG 900 turbopumps; 1ea Brooks transfer robot; 2ea Thermo Neslab Merlin M75 recirculating chillers; 1ea Neslab CFT-75 recirculating chiller; 3ea Ebara ESR20N vacuum pump; 1ea Ebara A25S vacuum pump.配置
無配置OEM 代工型號說明
STS Multiplex is a type of etcher that offers a large range of materials etching possibility such as insulators (SiO2, Si3N4 and SiC), silicon, metals (Al Alloys, Pt, Ti) and some polymers. It is dedicated for etching metals (processes under chlorine chemistry), quartz (fluorine/carbonate chemistry) and polyimide (oxygen chemistry). STS offers a range of different platform options, each compatible with all STS process technologies. The Multiplex has a single process chamber with manually loaded vacuum loadlock and carousel wafer handler for 2-4 wafers.文檔
無文檔