描述
LAM Rainbow 4526XL - 150mm Plasma Etch配置
200mm convertible: Yes Former process: oxidepets Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 80 x 40 x 130 Bypack2 weight (kg): 250 Bypack3 dim (cm): 47.5 x 93 x 126 Bypack3 weight (kg): 226.8OEM 代工型號說明
The Rainbow 4520XL is part of Lam Research’s Rainbow series of etch systems. This series addresses processes for wafers up to 200mm and feature sizes as small as 0.35 micron. The Rainbow product line includes the 4400, 4500, 4600, and 4700 series for etching polysilicon, oxide, aluminum, and tungsten films. These systems offer improved etch capability, reliability, and performance through unique features such as a patented wafer handling system and a proprietary source for generating stable plasma.文檔
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LAM RESEARCH CORPORATION
RAINBOW 4520XL
已驗證
類別
Dry / Plasma Etch
上次驗證: 今日
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條件:
Used
作業狀態:
未知
產品編號:
117192
晶圓尺寸:
未知
年份:
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Have Additional Questions?
Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
Available
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RAINBOW 4520XL
類別
Dry / Plasma Etch
上次驗證: 今日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
117192
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
LAM Rainbow 4526XL - 150mm Plasma Etch配置
200mm convertible: Yes Former process: oxidepets Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 80 x 40 x 130 Bypack2 weight (kg): 250 Bypack3 dim (cm): 47.5 x 93 x 126 Bypack3 weight (kg): 226.8OEM 代工型號說明
The Rainbow 4520XL is part of Lam Research’s Rainbow series of etch systems. This series addresses processes for wafers up to 200mm and feature sizes as small as 0.35 micron. The Rainbow product line includes the 4400, 4500, 4600, and 4700 series for etching polysilicon, oxide, aluminum, and tungsten films. These systems offer improved etch capability, reliability, and performance through unique features such as a patented wafer handling system and a proprietary source for generating stable plasma.文檔
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