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HITACHI HS-9050
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
    文檔

    無文檔

    類別
    Dry / Plasma Etch

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    125859


    晶圓尺寸:

    未知


    年份:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    HITACHI

    HS-9050

    verified-listing-icon
    已驗證
    類別
    Dry / Plasma Etch
    上次驗證: 超過60天前
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    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    125859


    晶圓尺寸:

    未知


    年份:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
    文檔

    無文檔