跳到主要內容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情

Moov logo

Moov Icon
TRESKY 3002/3102
  • TRESKY 3002/3102
  • TRESKY 3002/3102
描述
無描述
配置
無配置
OEM 代工型號說明
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
文檔

無文檔

類別
Die Bonders / Sorters / Attachers

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

16458


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

TRESKY

3002/3102

verified-listing-icon
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/XAQwjaY1Ybp10Xm_TYbFwgwBe3mzWkB4ARqcQT03-6c_20200316_115514_f
listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/Z8s9Hr7WYtuliFsQ9JZOFFnv5TANAEdACfITp3pmE9s_20200316_115514_f
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

16458


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
無配置
OEM 代工型號說明
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
文檔

無文檔