The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer

Die Bonder

TRESKY

概述

活躍中的上架商品

全部產品

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最熱門的 TRESKY Die Bonders / Sorters / Attachers

3002/3102

3001

T-6000-L

T-5100

利用 Moov 將其上架並立即找到完美的買家。

所有 TRESKY Die Bonders / Sorters / Attachers