描述
Flip Chip Bonder, working配置
無配置OEM 代工型號說明
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
131539
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
HANMI
FLIP CHIP BONDER-A110
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
131539
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Flip Chip Bonder, working配置
無配置OEM 代工型號說明
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.文檔
無文檔