FLIP CHIP BONDER-A110
概述
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.
活躍中的上架商品
1
服務
檢驗、保險、評估、物流
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.
1
檢驗、保險、評估、物流