描述
Bonding Machine Chip Bonder, a high-precision multi-chip bonding system in fully functional condition. This integrated dispensing system supports multiple dispensing methods and epoxy resin processing. Maximum production efficiency reaches 7,000 wafers/hour, with flip chip bonding efficiency up to 2,500 wafers/hour. X/Y-axis positioning accuracy: ±7μm; θ-axis positioning accuracy: ±0.15°. An ideal choice for semiconductor chip packaging production. Supports multiple wafer handling methods, suitable for 2-inch to 12-inch wafers. Includes original computer and keyboard with a clear, intuitive operating interface.配置
無配置OEM 代工型號說明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
140560
晶圓尺寸:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm
年份:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
BESI / DATACON
2200 EVO
類別
Die Bonders / Sorters / Attachers
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
140560
晶圓尺寸:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm
年份:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Bonding Machine Chip Bonder, a high-precision multi-chip bonding system in fully functional condition. This integrated dispensing system supports multiple dispensing methods and epoxy resin processing. Maximum production efficiency reaches 7,000 wafers/hour, with flip chip bonding efficiency up to 2,500 wafers/hour. X/Y-axis positioning accuracy: ±7μm; θ-axis positioning accuracy: ±0.15°. An ideal choice for semiconductor chip packaging production. Supports multiple wafer handling methods, suitable for 2-inch to 12-inch wafers. Includes original computer and keyboard with a clear, intuitive operating interface.配置
無配置OEM 代工型號說明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文檔
無文檔