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BESI / DATACON 2200 EVO
    描述
    Multi-Chip Bonder
    配置
    無配置
    OEM 代工型號說明
    The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.
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    類別
    Die Bonders / Sorters / Attachers

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    106685


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    BESI / DATACON

    2200 EVO

    verified-listing-icon
    已驗證
    類別
    Die Bonders / Sorters / Attachers
    上次驗證: 超過60天前
    listing-photo-8ccd4aa7fa7f4fa1bc7cdae4f5a7d2d1-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    106685


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Multi-Chip Bonder
    配置
    無配置
    OEM 代工型號說明
    The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.
    文檔

    無文檔

    類似上架商品
    查看全部