描述
Flip Chip Attach配置
無配置OEM 代工型號說明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文檔
無文檔
BESI / ESEC
2100
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 17 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116382
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100
類別
Die Bonders / Sorters / Attachers
上次驗證: 17 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116382
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Flip Chip Attach配置
無配置OEM 代工型號說明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文檔
無文檔