描述
Flip Chip Attach配置
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEM 代工型號說明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文檔
無文檔
BESI / ESEC
2100
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116385
晶圓尺寸:
8"/200mm
年份:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100
類別
Die Bonders / Sorters / Attachers
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116385
晶圓尺寸:
8"/200mm
年份:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Flip Chip Attach配置
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEM 代工型號說明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文檔
無文檔