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描述
Included Components: -EFEM with Three Load Ports -Main Body Part No: TRT-TMZZ -Chamber Part No: TEX-061 (Qty. 4) -Transformer Box: 3M80-001940-13 (Qty. 2) -Power Distribution Part No: MB-G2AAAA配置
TEL Tokyo Electron Triase+ 300mm CVD ASFD TiN Process System Load Ports: 3 Process: ASFD TiN Software: V5.650R1OEM 代工型號說明
The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.文檔
無文檔
類別
Deposition
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114272
晶圓尺寸:
12"/300mm
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
TRIASe+ EX-II TiN
類別
Deposition
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114272
晶圓尺寸:
12"/300mm
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Included Components: -EFEM with Three Load Ports -Main Body Part No: TRT-TMZZ -Chamber Part No: TEX-061 (Qty. 4) -Transformer Box: 3M80-001940-13 (Qty. 2) -Power Distribution Part No: MB-G2AAAA配置
TEL Tokyo Electron Triase+ 300mm CVD ASFD TiN Process System Load Ports: 3 Process: ASFD TiN Software: V5.650R1OEM 代工型號說明
The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.文檔
無文檔