描述
VIA W配置
VIA WOEM 代工型號說明
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.文檔
無文檔
APPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
已驗證
類別
Deposition
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91266
晶圓尺寸:
12"/300mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
類別
Deposition
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91266
晶圓尺寸:
12"/300mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
VIA W配置
VIA WOEM 代工型號說明
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.文檔
無文檔