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CENTURA AP ISPRINT
概述
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.
活躍中的上架商品
3
服務
檢驗、保險、評估、物流
