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KLA AIT III
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    配置
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    OEM 代工型號說明
    The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.
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    KLA

    AIT III

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    類別

    Defect Inspection
    上次驗證: 超過60天前
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    Parts Tool


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    產品編號:

    90112


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    年份:

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    上次驗證16 天前

    KLA

    AIT III

    verified-listing-icon

    已驗證

    類別

    Defect Inspection
    上次驗證: 超過60天前
    listing-photo-8e70bb31fda049658af241b08b1a1d9f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Parts Tool


    作業狀態:

    未知


    產品編號:

    90112


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.
    文檔

    無文檔

    類似上架商品
    查看全部
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    Defect Inspection年份: 0條件: 零件工具上次驗證: 超過60天前
    KLA AIT III
    KLA
    AIT III
    Defect Inspection年份: 0條件: 零件工具上次驗證: 超過60天前