描述
System dimensions (cm): 80x85 x188 Weight : 330 Kg配置
-Capable of 4"-8" wafers. -Non-patterned surface Inspection System. -0.12 micron Defect Sensitivity @ 95% capture, based on PSL Standards. -0.02 ppm Haze Sensitivity. -Waves Length 488 nm, 30mw ArLaser, Blue Laser , Spot Size 90µ; -Scan Frequency 170 Hz; Scan Pitch: 10,20 and 40µ; -Throughput 120/6" wph -Single puck handling from single cassette or platform -Win 98 software, CD ROM Writer software version: 4. 2 -XY coordinates, GEM SECS: options availableOEM 代工型號說明
The Surfscan 6420 detects submicron defects on metal films and rough surfaces but still provides sensitivity down to 0.1 micron on polished silicon. It is effective for detecting defects on non-uniform films, a critical requirement for CMP applications.文檔
無文檔
KLA
SURFSCAN 6420
已驗證
類別
Defect Inspection
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113497
晶圓尺寸:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份:
1996
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
KLA
SURFSCAN 6420
類別
Defect Inspection
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113497
晶圓尺寸:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份:
1996
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
System dimensions (cm): 80x85 x188 Weight : 330 Kg配置
-Capable of 4"-8" wafers. -Non-patterned surface Inspection System. -0.12 micron Defect Sensitivity @ 95% capture, based on PSL Standards. -0.02 ppm Haze Sensitivity. -Waves Length 488 nm, 30mw ArLaser, Blue Laser , Spot Size 90µ; -Scan Frequency 170 Hz; Scan Pitch: 10,20 and 40µ; -Throughput 120/6" wph -Single puck handling from single cassette or platform -Win 98 software, CD ROM Writer software version: 4. 2 -XY coordinates, GEM SECS: options availableOEM 代工型號說明
The Surfscan 6420 detects submicron defects on metal films and rough surfaces but still provides sensitivity down to 0.1 micron on polished silicon. It is effective for detecting defects on non-uniform films, a critical requirement for CMP applications.文檔
無文檔