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TEL / TOKYO ELECTRON TRIASe+ W
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
    文檔

    無文檔

    TEL / TOKYO ELECTRON

    TRIASe+ W

    verified-listing-icon

    已驗證

    類別
    CVD

    上次驗證: 7 天前

    關鍵商品詳情

    條件:

    New


    作業狀態:

    未知


    產品編號:

    116431


    晶圓尺寸:

    12"/300mm


    年份:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
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    TEL / TOKYO ELECTRON TRIASe+ W

    TEL / TOKYO ELECTRON

    TRIASe+ W

    CVD
    年份: 2022條件: 全新
    上次驗證7 天前

    TEL / TOKYO ELECTRON

    TRIASe+ W

    verified-listing-icon
    已驗證
    類別
    CVD
    上次驗證: 7 天前
    listing-photo-1ca4b1d95de44bd98b06075cd6c4cc1b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    New


    作業狀態:

    未知


    產品編號:

    116431


    晶圓尺寸:

    12"/300mm


    年份:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
    文檔

    無文檔

    類似上架商品
    查看全部
    TEL / TOKYO ELECTRON TRIASe+ W

    TEL / TOKYO ELECTRON

    TRIASe+ W

    CVD年份: 2022條件: 全新上次驗證:7 天前