描述
TFM_Cu Barrier Seed_Novellus , CH1 - HCM Cu ALP (2%Mn), CH3 - HCM Ta IONX, CH4 - Cool station, CH5 - HCM Ta IONX, CH7 - HCM Cu AS (2%Mn))配置
無配置OEM 代工型號說明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文檔
無文檔
類別
CVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
128077
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
INOVA
類別
CVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
128077
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
TFM_Cu Barrier Seed_Novellus , CH1 - HCM Cu ALP (2%Mn), CH3 - HCM Ta IONX, CH4 - Cool station, CH5 - HCM Ta IONX, CH7 - HCM Cu AS (2%Mn))配置
無配置OEM 代工型號說明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文檔
無文檔