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LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
描述
無描述
配置
3 PMs (8" Convertible) Robot : Brooks Metal PVD deposition Process (Product ): Sputtering Process Modules Configuration 1. Cassette Load Lock Modules -Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, -Leybold TMP/NT 150/360V/H turbo pump 2. Desorb Modules For wafers orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump 3. Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. 4. PVDCathode -AE MDX Magatron DrivePower Supply . -CTI cryo on board 8 and 8300 compressor. -VAT Gate valve series 14 -AlCu target 14” diameter 5. PVD Cathode Same as 4. TaAl target 14” diameter
OEM 代工型號說明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.
文檔

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類別
CVD

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

63716


晶圓尺寸:

6"/150mm, 8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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LAM RESEARCH / NOVELLUS

CONCEPT TWO "C2"

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已驗證
類別
CVD
上次驗證: 超過60天前
listing-photo-97019ce493f74cd4910af45014f1777b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/4463/97019ce493f74cd4910af45014f1777b/1ac618ccb5754548b9c97dc2158fcca9_01b37154e6f84027ab1e295ed0c421851201a_mw.jpeg
listing-photo-97019ce493f74cd4910af45014f1777b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/4463/97019ce493f74cd4910af45014f1777b/0ee19ec0b98e4f7e81f8e9ff315e6d99_59d1bc6349734be69fb523910586bb7f_mw.jpeg
listing-photo-97019ce493f74cd4910af45014f1777b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/4463/97019ce493f74cd4910af45014f1777b/ef05147905c14d798ae9f7690c9e7d52_a1db2b14510f474c98fa4b47e38108c3_mw.jpeg
listing-photo-97019ce493f74cd4910af45014f1777b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/4463/97019ce493f74cd4910af45014f1777b/d23bb7ad21e247548e4c35f3b932d084_92577daa9b354e1fb81556200e4659941201a_mw.jpeg
listing-photo-97019ce493f74cd4910af45014f1777b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/4463/97019ce493f74cd4910af45014f1777b/ee9f8b0b434d41828c6c82db42c2b298_cae7bdc034fb4ef086ec3f739aa42edf_mw.jpeg
listing-photo-97019ce493f74cd4910af45014f1777b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/4463/97019ce493f74cd4910af45014f1777b/1fa8d53429ed4a18a4da4b7e853754fc_412a3cb507ce47b8852caa67e43bfb061201a_mw.jpeg
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

63716


晶圓尺寸:

6"/150mm, 8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
3 PMs (8" Convertible) Robot : Brooks Metal PVD deposition Process (Product ): Sputtering Process Modules Configuration 1. Cassette Load Lock Modules -Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, -Leybold TMP/NT 150/360V/H turbo pump 2. Desorb Modules For wafers orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump 3. Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. 4. PVDCathode -AE MDX Magatron DrivePower Supply . -CTI cryo on board 8 and 8300 compressor. -VAT Gate valve series 14 -AlCu target 14” diameter 5. PVD Cathode Same as 4. TaAl target 14” diameter
OEM 代工型號說明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.
文檔

無文檔