跳到主要內容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情

Moov logo

Moov Icon
LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"
描述
Dual Sequel TEOS, Non Shrink
配置
Dual Sequel TEOS, Non Shrink
OEM 代工型號說明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.
文檔

無文檔

類別
CVD

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

105249


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部

LAM RESEARCH / NOVELLUS

CONCEPT TWO "C2"

verified-listing-icon
已驗證
類別
CVD
上次驗證: 超過60天前
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/feacff83ac9b4c9eaafd55f518e4b15e_8bd51f301e7549dd9ef738048196e60e4b26f930370d414bb78d2c7a761b22601201af_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/6bf3ec8d7325416e9dabe88a3ca50a2f_60af9d7c3fee40c3932335d79fce8d021201a_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/1cae5baeb2874d0f89e7843a906d6b79_a1d00c6bd3674ef0b44b5dff3d5dcc4a1201a_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/3534c7ff58b94e0181eda9204c070ac8_b0900915372a48bea0ca59050ed5e8dd1201a_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/ba1499fd04ef4717bd1ed5f34c60aae7_2c5041aef9c34a00b7caca4279a1d5c21201a_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/ff9871e9d7534fd5aa96b17c8f3b125a_29b4edaeede1414e881266dcfc16e7341201a_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/68a162d1f7634c8abe47b804144f2c02_d052f6d734414c65a2e866051981e8101201a_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/af1eb3f6800b4fee954e49a595006c67_4adea0c4d1024514b7f4a26e2dbf343d1201a_mw.jpeg
listing-photo-608b0b1d168c4dcdb89972a7ea26ba33-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74631/608b0b1d168c4dcdb89972a7ea26ba33/eca21b6448b542a6a690df154c4c8a6a_379d2c0267234971b763f419ce0cc5c2_mw.jpeg
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

105249


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Dual Sequel TEOS, Non Shrink
配置
Dual Sequel TEOS, Non Shrink
OEM 代工型號說明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.
文檔

無文檔