跳到主要內容
Moov logo

Moov Icon
LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.
    文檔

    無文檔

    類別
    CVD

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    114141


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    LAM RESEARCH / NOVELLUS

    CONCEPT TWO "C2" DUAL SEQUEL

    verified-listing-icon
    已驗證
    類別
    CVD
    上次驗證: 超過60天前
    listing-photo-b47c3b459fc849b6b06cede7122e7793-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    114141


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.
    文檔

    無文檔