描述

Multi Block Resist Coater/Developer

配置

· 4 Blocks: 1 Carrier, 2 Multi-purpose, 1 Process · 6 (250 WPH) Transfer Robot arms: 1 Carrier, 2 Multi-purpose, 3 Process · Stainless Exhaust Lines below Track · SECS1, SECS11, HMDS & GEM Interface required is iUSC · E87/GJG compliance · 2 Piece Wafer Block · Stack 1: No Process Modules – only HMDS Bubblers · Stack 2: No Process Modules – only HMDS Bubblers · Stack 3: 12 CADH modules (no spin modules) · Stack 4: 3 BCT Cups with 10 Nozzles · Stack 5: 3 BCT Cups with 10 Nozzles · AC Power Box with Noise filter: CE Mark Type · AC Power Box 208volts, 3-phase, star, 50/60Hz compatible, SCCR requirements Cassette Block (CSB) · (5) FOUP Loadports (with N2 purge Pre-plumbing) · Carrier RFID capability on CSB · CSB Pressure Sensor Main Block with 5 Process Stacks · Stack 1 & 2 No Process Modules or Robotic Arms o 12 HMDS Bubbler System · Stack 3 HMDS Processing Only o 1 Process Robotic Arm · Stack 4 BARC Processing o (4) BCT Modules with TCT style cups and backside rinse nozzles o (10) 1.2 mm Resist nozzles, (1) SRRC nozzle with Temp control per layer o (10) 0.8 mm Resist nozzles, (1) ARRC nozzle with Temp control per layer o (10) 3ml CRD resist dispense pumps o (10) 3ml ACRD resist dispense pumps o (10) Single Bottle Resist Supply Configuration o EBR angle adjustment capability o Bulk-FSI system for solvent dispense o Exhaust Pressure Control (EPC) per stack o Exhaust duct and drain case cleaning function o Exhaust Thermo Controller System in STHC o 4 Dispense Detection Systems (all COT modules) o Bevel Rinse nozzle (Ver 2) o IFF-S for RRC lines with ARRC-s o IFF-R (for Resist) · Stack 5 BARC Processing o (4) BCT Modules with TCT style cups and backside rinse nozzles o (10) 1.2 mm Resist nozzles, (1) SRRC nozzle with Temp control per layer o (10) 0.8 mm Resist nozzles, (1) ARRC nozzle with Temp control per layer o (10) 3ml CRD resist dispense pumps o (10) 3ml ACRD resist dispense pumps o (10) Single Bottle Resist Supply Configuration o EBR angle adjustment capability o Bulk-FSI system for solvent dispense o Exhaust Pressure Control (EPC) per stack o Exhaust duct and drain case cleaning function o Exhaust Thermo Controller System in STHC o 4 Dispense Detection Systems (all COT modules) o Bevel Rinse nozzle (Ver 2) o IFF-S for RRC lines with ARRC-s o IFF-R (for Resist) · (12) Chilling Adhesion Processing Station (CADH) o Wafer Wedging function using Plate Temperature sensor SW calculation o (2) Bubbler Type HMDS Tank located in Main processing block o Gap Pin type UPIMOL proximity pins on chilling arm · (6) Slim Chill Plate Process Station (SCPL) o Wafer wedging function using vacuum detection sensor o Gap Pin type UPIMOL proximity pins on chilling arm · (2) Chilling High Precision Hot Plate Process Station (CHCH) o Heated Exhaust Chamber o Wafer Wedging function using Plate Temperature sensor SW o Gap Pin type ceramic proximity pins on chilling arm · (14) General Purpose Hot Plate Process Station (CGCH) o Heated Exhaust Chamber o Wafer Wedging function using Plate Temperature sensor SW o Gap Pin type UPIMOL proximity pins on chilling arm · (1) TEL System Temp and Humidity Controller (STHC) o (1) Shinwa unit for system environment control, chemical temperature control and CPL temperature control o (1) Return Air Box - Plenum · (2) New Style Chemical Cabinets o (1) HMDS Canister (3 gallons with gauge) o (1) 3-Pump Solvent chemical supply system o (1) 2-Pump Developer chemical supply system o (1) Sub operation panel o Top side facility connection o CRF for solvent based PCS · (1) New Style AC Power Box o Dual Feed facility supply power with 2 separate breakers o Top side facility connection o Ring type GND connection

OEM 代工型號說明

CLEAN TRACK™ LITHIUS Pro™ V incorporates all of the advanced technology of the proven CLEAN TRACK™ LITHIUS Pro™ V. It enables higher throughput, increases wafers per day, and improves overall equipment efficiency. Additionally, it also meets industry requirements for versatile lithography equipment capable of leading edge processes, including double patterning.