概述

"The ACS200Plus is a versatile spin coating and developing system designed for round wafers (2 inches to 200 mm) and square substrates (2 inches to 6 inches). It excels in various techniques like spin coating, spray coating, baking, and developing for applications including thin/thick adhesives and photosensitive polymers. It meets the demands of cutting-edge photoresist processes in optoelectronics, MEMS, and advanced packaging. With its modular design, the ACS200Plus offers flexibility for R&D, trial production, and mass production. Configurable with 2, 4, or 6 process modules around a central manipulator, it allows for scalability by adding additional modular units. The optional GYRSET module creates a uniform coating environment by minimizing disturbances and forming solvent-rich coatings. For a comprehensive lithography solution, the ACS200Plus can be combined with the MA200Compact mask alignment lithography machine to form the integrated LithoFab200 system."