描述
Litho配置
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM 代工型號說明
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.文檔
無文檔
SUSS MicroTec / KARL SUSS
ACS200 Gen3
已驗證
類別
Coaters & Developers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Idle
產品編號:
111541
晶圓尺寸:
未知
年份:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
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SUSS MicroTec / KARL SUSS
ACS200 Gen3
類別
Coaters & Developers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Idle
產品編號:
111541
晶圓尺寸:
未知
年份:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Litho配置
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM 代工型號說明
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.文檔
無文檔