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描述
Package Grinder配置
無配置OEM 代工型號說明
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.文檔
無文檔
DISCO
DFS8960
類別
CMP
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
111735
晶圓尺寸:
未知
年份:
2013
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描述
Package Grinder配置
無配置OEM 代工型號說明
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.文檔
無文檔