概述

2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.