描述
Wafer bonding system配置
SOI and direct wafer bondingOEM 代工型號說明
The EVG®850XT (frequently referred to as the EVG850 XT configuration) is an industry-grade, fully automated universal temporary bonding and debonding platform manufactured by EV Group (EVG).文檔
無文檔
類別
Bonders
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
154290
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 XT
類別
Bonders
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
154290
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer bonding system配置
SOI and direct wafer bondingOEM 代工型號說明
The EVG®850XT (frequently referred to as the EVG850 XT configuration) is an industry-grade, fully automated universal temporary bonding and debonding platform manufactured by EV Group (EVG).文檔
無文檔