The EVG®850XT (frequently referred to as the EVG850 XT configuration) is an industry-grade, fully automated universal temporary bonding and debonding platform manufactured by EV Group (EVG).

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVG850 XT

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EVGROUP (EVG)

EVG850 XT

EVGROUP (EVG)

EVG850 XT

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