描述
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm (6"setting) Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding配置
無配置OEM 代工型號說明
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).文檔
無文檔
EVGroup (EVG)
EVG810 LT
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
98353
晶圓尺寸:
8"/200mm
年份:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG810 LT
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
98353
晶圓尺寸:
8"/200mm
年份:
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm (6"setting) Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding配置
無配置OEM 代工型號說明
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).文檔
無文檔