The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVGroup (EVG)

EVG810 LT

Low Temp. Plasma Activation System for wafer bonding  
Maker: EVG (EVGroup)  
Model: EVG 810 LT   
Type: Manual Type   
EQP. Size(W*L*H): 1520*1210*1530 (mm)   
Wafer Size: 50 ~ 200mm (6"setting)
Process : Silicon, Glass, GaAs, Etc
Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding

EVG810 LT

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