描述
Working Condition.配置
無配置OEM 代工型號說明
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.文檔
無文檔
BESI / ESEC
2007 SSI
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
35556
晶圓尺寸:
未知
年份:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部BESI / ESEC
2007 SSI
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
35556
晶圓尺寸:
未知
年份:
1999
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Working Condition.配置
無配置OEM 代工型號說明
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.文檔
無文檔