描述
無描述配置
Not Working / RefurbishedOEM 代工型號說明
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.文檔
無文檔
BESI / ESEC
2007 SSI
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
70841
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2007 SSI
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
70841
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Not Working / RefurbishedOEM 代工型號說明
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.文檔
無文檔