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描述
無描述配置
300mm optional 200mm Incl chiller, pumps, gasboxes decomissioned in working conditioning, in production till April 2022 System comes incl following spare parts. Spare chamber module, All quarts parts used for 1 chamber Main Computer Microwave 3 pieces Lampcontrollers etc. Lamps approx. 75 pieces Touchscreen SMC foreline valve Throttle valve Edwards IH1800NRV pumps only 12.000 /10.000 Hrs running timeOEM 代工型號說明
The FusionES3 is a 300mm plasma asher with dry strip capabilities, designed for post-implant and post-etch process steps. It has a flexible process architecture, making it suitable for conventional and dual damascene process flows. It provides dry resist and residue removal, and its elevated ash rate delivers high throughput and productivity. The tool is designed to run oxidizing, fluorinated, and reducing chemistries. Its unique dual-chamber platform enables dry strip and residue removal to be performed within a single chamber, increasing productivity and reducing the system footprint.文檔
無文檔
類別
Ashers / Plasma Cleaner
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65306
晶圓尺寸:
12"/300mm
年份:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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AXCELIS / FUSION
FUSION ES3
類別
Ashers / Plasma Cleaner
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65306
晶圓尺寸:
12"/300mm
年份:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
300mm optional 200mm Incl chiller, pumps, gasboxes decomissioned in working conditioning, in production till April 2022 System comes incl following spare parts. Spare chamber module, All quarts parts used for 1 chamber Main Computer Microwave 3 pieces Lampcontrollers etc. Lamps approx. 75 pieces Touchscreen SMC foreline valve Throttle valve Edwards IH1800NRV pumps only 12.000 /10.000 Hrs running timeOEM 代工型號說明
The FusionES3 is a 300mm plasma asher with dry strip capabilities, designed for post-implant and post-etch process steps. It has a flexible process architecture, making it suitable for conventional and dual damascene process flows. It provides dry resist and residue removal, and its elevated ash rate delivers high throughput and productivity. The tool is designed to run oxidizing, fluorinated, and reducing chemistries. Its unique dual-chamber platform enables dry strip and residue removal to be performed within a single chamber, increasing productivity and reducing the system footprint.文檔
無文檔