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AXCELIS / FUSION FUSION ES3
    描述
    ETCH
    配置
    無配置
    OEM 代工型號說明
    The FusionES3 is a 300mm plasma asher with dry strip capabilities, designed for post-implant and post-etch process steps. It has a flexible process architecture, making it suitable for conventional and dual damascene process flows. It provides dry resist and residue removal, and its elevated ash rate delivers high throughput and productivity. The tool is designed to run oxidizing, fluorinated, and reducing chemistries. Its unique dual-chamber platform enables dry strip and residue removal to be performed within a single chamber, increasing productivity and reducing the system footprint.
    文檔

    無文檔

    類別
    Ashers / Plasma Cleaner

    上次驗證: 超過30天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    130678


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    AXCELIS / FUSION

    FUSION ES3

    verified-listing-icon
    已驗證
    類別
    Ashers / Plasma Cleaner
    上次驗證: 超過30天前
    listing-photo-c5c4288bf3f040e8a43c196c06e75311-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    130678


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    ETCH
    配置
    無配置
    OEM 代工型號說明
    The FusionES3 is a 300mm plasma asher with dry strip capabilities, designed for post-implant and post-etch process steps. It has a flexible process architecture, making it suitable for conventional and dual damascene process flows. It provides dry resist and residue removal, and its elevated ash rate delivers high throughput and productivity. The tool is designed to run oxidizing, fluorinated, and reducing chemistries. Its unique dual-chamber platform enables dry strip and residue removal to be performed within a single chamber, increasing productivity and reducing the system footprint.
    文檔

    無文檔