描述
無描述配置
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM 代工型號說明
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.文檔
無文檔
類別
AOI
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152849
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
類別
AOI
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152849
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM 代工型號說明
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.文檔
無文檔