Semitool is supplies electrochemical plating and wafer surface preparation equipment used by chip packaging and chip making companies around the world.

The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package. 

APPLIED MATERIALS (AMAT) / SEMITOOL

RAIDER ECD

The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.

RAIDER ECD310

The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.

RAIDER ECD-312

The Raider SP is a fully automated system with up to ten single-wafer process chambers for high volume production. The flexibility of its linear design makes it one of the most versatile wet cleaning, stripping and etching platforms in the industry. The tool can be equipped with our proprietary Capsule chamber, which allows side selectable processing. In addition, the system can be equipped with spray, immersion, megasonic, or vapor process chambers. Applications include wafer backside, bevel and edge clean for removal of unwanted copper and other contamination, post-etch polymer removal, critical pre-deposition cleans, and metal etching. The Raider SP is available to accommodate 150mm, 200mm & 300mm wafer sizes. The Applied Raider SP can incorporate several types of cleaning methods, including spray, vapor, immersion, megasonics and anneal technologies with automated single or dual-side wafer processing for high volume manufacturing.

RAIDER SP	

The Applied Raider® Edge ECD (electrochemical deposition) system is the industry benchmark for single wafer electroplating technology. The Raider Edge offers flexibility with wafer sizes at 150, 200 and 300mm. Supporting multiple applications on one platform, it is capable of plating and etching a wide range of metals and alloys in addition to cleaning and dielectric layer etching and can work with multiple substrate types & thicknesses. 

RAIDER EDGE ECD

The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.

RAIDER S ECD

RAIDER ECD314

The Raider M (Mini) is a state-of-the-art single-wafer Electrochemical Deposition (ECD) system. It is fully automated and features two chambers, making it ideal for both product development and pilot production. With its high-performance capabilities, the Raider M is a reliable and efficient choice for your ECD needs.

RAIDER MINI

The Raider™ SP310 is a 300mm single wafer, precision, high volume surface preparation system. It incorporates a variety of technologies including spray, vapor, immersion, megasonics, and anneal to provide automated single or dual-side wafer processing. This system is designed to provide efficient and effective surface preparation for semiconductor wafers.

RAIDER SP310

The Raider Mini Quattro ECD is a high-performance single-wafer Electrochemical Deposition (ECD) system with precision, fully automated wafer handling, and multiple process chambers. It has a small footprint, can handle up to 300mm substrates, and has on-board chemistry handling. The system is part of a platform that allows for seamless transfer from R&D to full production. It is a versatile and efficient system for electrochemical deposition processes.

RAIDER MINI QUATTRO

The Applied Raider GT ECD for electroplating advanced chip interconnect structures. Raider GT ECD is a copper plating tool and is a 300 mm wafer processor. The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. A multi-zone anode array enables electroplating on ultra-thin and resistive seed layers.


APPLIED MATERIALS (AMAT) / SEMITOOL

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