概述

The Applied Raider GT ECD for electroplating advanced chip interconnect structures. Raider GT ECD is a copper plating tool and is a 300 mm wafer processor. The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. A multi-zone anode array enables electroplating on ultra-thin and resistive seed layers.