KLA-Tencor Corp. announced it has completed its acquisition of ADE Corp., a supplier of silicon wafer metrology and related gear.

AFS 3220, utilize high voltage fast differential charge amplifiers with low noise DAC oscillator, 375 KHz synchronized DC/DC converter power supplies, antialising filter and ADC. The 3220 AFS system is the company's latest in a line of non contact capacitance-based wafer geometry measurement systems.

KLA / ADE

AFS-3220

NANOMAPPER

The ADE 9500 UltraGage is a benchmark in wafer geometry characterization, essential in device fabrication and silicon wafer manufacturing. It accurately measures thickness, flatness, bow/warp, and more, using noncontact methods with 10nm resolution, applicable to both patterned and polished wafers. This compact tool offers nondestructive control, with options for manual or cassette operation, and supports optional networking including SECS/GEM. Ideal for applications in photolithography, CMP, and other processes, the UltraGage is a versatile, high-performance metrology solution.

ULTRAGAGE 9500

The UltraScan 9000 series of products are high throughput, in-line production systems that perform metrology and sorting at various stages of the wafer manufacturing and device fabrication processes. The 9300 and 9350 systems, introduced in 1990, employ the Company's E station measurement module to measure thickness down to an accuracy of 0.5 microns.

ULTRASCAN 9300

A new wafer flatness and shape metrology tool for 300mm and advanced 200mm production, the WaferSight measurement precision allows wafer and device manufacturers to meet ITRS metrology requirements down to the 35nm generation. Utilizing optical technologies, the WaferSight system extends ADE’s market presence in wafer dimensional metrology.

WAFERSIGHT

INM100+INS10

AWIS 3110

WAFERSIGHT3

The UltraGage 9700 system, introduced in 1995, is based on the E-Plus station measurement module. The UltraGage 9000 systems are capable of being operated in a class 10 cleanroom environment. These systems were designed to operate together with applications software to be used by device manufacturers in applications such as chemical mechanical planarization ("CMP") and thermal processing.

ULTRAGAGE 9700

UltraScan Wafer Metrology System
The 9600 and 9650 systems, introduced in 1994 and based on the more advanced E-Plus station, measure thickness down to an accuracy of 0.25 microns. 

ULTRASCAN 9600

WAFERXAM

Wafer flatness measurements to 90nm line widths, 200mm/300mm, SOI and bare wafer capability. Measures thickness of wafers by electrical capacitance.

AFS-3220 FA

The MicroXAM-800 combines the best hardware and algorithms from the Ambios and ADE Phase Shift interferometry platforms with new, innovative, easy-to-use software for automated measurements of step height and roughness.

MicroXAM-800

ADE Phase Shift releases the MicroXAM optical profiler, with Angstrom-level sensitivity in phase shifting interferometry for super smooth surfaces and vertical scanning interferometry for samples with larger step heights.

MicroXAM

The AFS-300 series systems operate in a class 10 cleanroom, utilizing ADE's E-Plus station for precision. They measure wafer properties with high accuracy (0.25 microns), including thickness, flatness, shape, conductivity, and resistivity. Integration with factory automation is seamless through standard protocols.

AFS-300

Low Cost Thickness, Shape and Global Flatness Measurement System. Measures 8,700 data points in under 60 seconds. Thickness measurements from 250µm to 750µm. Shape measurements to 1,100µm. Patterned, polished or taped wafer surfaces. Expandable and upgradable.

 ULTRAGAGE  9520

FIT 3120

Wafer flatness and nanotopography. 130nm to 35nm line widths, 200mm/300mm, SOI and bare wafer capability. Uses the wave properties of light
to optically measure wafer shape.

NANOMAPPER FA

WIS SERIES The WIS series products are high throughput, in-line production systems that are used to detect, measure and characterize particles and other defects on wafer surfaces and provide process analysis and control information for the wafer manufacturer. The first of these optical-based systems was introduced in 1981, CR80.

WIS-CR80

The 9530-NT applies ADE's industry-standard metrology to backgrind, etch and lap processes that reduce wafer thickness to as little as 150 microns. It is designed for production operations that demand high-performance metrology for equipment setup, process qualification and ongoing process control of next-generation wafer-thinning processes. The 9530-NT measures wafers as thin as 150 micron while keeping wafers safely centered within its dynamic measurement range.

ULTRAGAGE 9530-NT

The Constellation is a fully automated inspection tool designed to handle the needs of both 200mm and 300mm polished and epi wafer inspection. Constellation offers advanced inspection capabilities for high volume 200 mm production, while offering simple, software-driven conversions to handle 300 mm pilot and production requirements.

CONSTELLATION

the WIS-CR81 and WIS-CR82, introduced in 1997, detect particles down to 0.1 microns on wafers up to 200 millimeters in diameter. The WIS systems can be integrated with factory automation systems using industry standard protocols. A variety of software packages are available from the Company to tailor the system to specific customer requirements. The WIS systems are capable of being operated in a class 10 cleanroom environment.

WIS-CR81

3910

The 9600 and 9650 systems, introduced in 1994 and based on the more advanced E-Plus station, measure thickness down to an accuracy of 0.25 microns.The 9350 and 9650 systems have a smaller footprint than their larger counterparts, making them more suitable for applications in the device fabrication process, including photolithography, thermal processing, CMP and thin film deposition.

ULTRASCAN 9650

The WaferCheck 7000 series of products are flexible, modular systems capable of automatically characterizing, inspecting and sorting semiconductor wafers. The WaferCheck 7000, the first large-scale, automated metrology system for the wafer manufacturing market, was introduced by the Company in 1983.

WAFERCHECK 7000

The 9505-NT UltraGage characterizes thin-film stress and wafer shape for both patterned and monitor wafers. It provides fast, high-resolution measurements in two dimensions, and it correlates with x-ray diffraction, which is the only direct measure of thin film stress. It is not sensitive to film type, reflectivity or other optical reflections that may result from subsurface multi-layer stacks. An off-line software package enables the 9505-NT to measure both local and global stress.

ULTRAGAGE 9505-NT

The AWIS-300 series systems, currently in the final stages of development, are based on ADE's proprietary ARS (Angle Resolved Scatter) technologies for the optical inspection of bare and film wafer surfaces, and are intended for use in a class 1 or better cleanroom environment. The AWIS-300 is designed to provide the combination of front and backside measurement, sensitivity, throughput and sorting capabilities required by wafer manufacturers.

AWIS-300

The Autogager 1500, the first large-scale, automated dimensional metrology system for the hard disk market, was introduced by the Company in 1996 to meet the industry's increasing demand for the manufacture of Magneto-Resistive ("MR") quality hard disks. These systems measure thickness and thickness variation on advanced hard disks and provide high speed sorting. The products combine an industrial robot with the company's capacitive dimensional metrology into a single, floor-mounted system. These systems, which are capable of operating in a class 1000 cleanroom environment, provide a non-destructive in-line sorting capability and precise disk classification at submicron accuracies.

AUTOGAGER 1500

NanoXam is the first ADE metrology tool specifically developed as patterned wafer metrology tool for copper CMP processes. 

NANOXAM

To meet the industry's increasing demand for the manufacture of 200 millimeter wafers, the Company introduced the WaferCheck 7200 in 1987. These systems measure thickness, flatness, shape, conductivity type, and resistivity on as-cut and etched wafers and provide high speed sorting. The products combine an automated transfer belt module with one or more customer selected measurement modules into a single, floor mounted system. These systems, which are capable of operating in a class 1000 cleanroom environment, provide a non-destructive in-line sorting capability and precise wafer classification at submicron accuracies.


WAFERCHECK 7200

WIS-CR82

ULTRASCAN 8300

The UltraScan 9000 series of products are high throughput, in-line production systems that perform metrology and sorting at various stages of the wafer manufacturing and device fabrication processes. The 9300 and 9350 systems, introduced in 1990, employ the Company's E station measurement module to measure thickness down to an accuracy of 0.5 microns. The 9350 and 9650 systems have a smaller footprint than their larger counterparts, making them more suitable for applications in the device fabrication process, including photolithography, thermal processing, CMP and thin film deposition.

ULTRASCAN 9350

MicroXAM-100

The EpiScan 1000 system, introduced in 1997, is based on advanced, model-based FTIR (Fourier Transform Infrared Spectroscopy) technology licensed to the Company by On-Line Technologies, Inc. The system is capable of being operated in a class 10 cleanroom environment.

EPISCAN 1000

The EpiScan 9900 series of products are benchtop metrology systems containing a single measurement module, which is capable of making selected measurements, including Epi thickness, thickness variation and dopant profile. The EpiScan 9900 system, introduced in 1997, is based on advanced, model-based FTIR (Fourier Transform Infrared Spectroscopy) technology licensed to the Company by On-Line Technologies, Inc. The  EpiScan 9900 system is capable of being operated in a class 10 cleanroom environment.

EPISCAN 9900

 WaferSight2™ is an optical interferometry-based metrology system that enables wafer suppliers and chipmakers to measure bare wafer dimensional parameters such as flatness, shape, edge roll-off and nanotopography in one system. With industry-leading flatness and nanotopography precision, plus improved tool-to-tool matching, WaferSight2 enables leading-edge production of next-generation wafers by wafer suppliers, and higher confidence of incoming wafer quality for IC makers.

KLA / ADE

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