概述

To meet the industry's increasing demand for the manufacture of 200 millimeter wafers, the Company introduced the WaferCheck 7200 in 1987. These systems measure thickness, flatness, shape, conductivity type, and resistivity on as-cut and etched wafers and provide high speed sorting. The products combine an automated transfer belt module with one or more customer selected measurement modules into a single, floor mounted system. These systems, which are capable of operating in a class 1000 cleanroom environment, provide a non-destructive in-line sorting capability and precise wafer classification at submicron accuracies.