ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.

The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.

EAGLE XP

F09F462D-5DE8-428D-A1F4-FD98313D5730_4_5005_c.jpeg

3B42BD4F-7720-43DF-9DC7-931FE7A9CDB8_1_201_a.jpeg

D61B7E70-586A-4A12-97EA-DFE10BCF1EB4_4_5005_c.jpeg

B03BFF4B-6859-4E9F-B4A9-FA11AC2852F6_4_5005_c.jpeg

58902359-C293-4BEE-9FD3-57AB4F1858B2.png

9E0C21B6-231D-4844-8C29-655EA1710FDB.png

4B5A993C-4862-450B-8EB0-9DBC8B103CD9.png

AD564C50-C47D-46EB-87D6-D8C24C7E6068.png

C5A5F420-2A35-4998-AA68-96F9FE6AFB48.png

9B9F4B40-0C49-4EBE-B1D9-E14340E7BFE6.png

88D7C949-5D0C-47B3-B0B4-28742F055440.png

84FE5A36-DD76-4631-BD0A-694B779EC60D.png

71B6FB84-B43C-4A86-8DD4-365766172703_1_201_a.jpeg

ASM

EAGLE XP

ALD

類似上架商品

ASM

EAGLE XP

ASM

EAGLE XP

ASM

EAGLE XP

ASM

EAGLE XP

EAGLE XP

ALD

類似上架商品

ASM

EAGLE XP

ASM

EAGLE XP

ASM

EAGLE XP

ASM

EAGLE XP