描述
X-Ray Metrology配置
D8 FABLINE MH with TXS 1 High Brightness (2KW) Bruker Rotating Anode HB-TXS Spartan EFEM dual load port for 300mm wafers 2 Brooks Automation Automation software PTO from Peer Group 1 UMC 300 wafer stage with short tracks on primary side 1 Primary optics for micro diffraction, TXS X-ray system 1 LynxEye detector for secondary side + mount 1 Waferchuck 1 Pattern recognition software 1 Keyence laser triangulation module for fast height alignment 1 c.OEM 代工型號說明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.文檔
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BRUKER
D8 FABLINE
已驗證
類別
X-Ray
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
95109
晶圓尺寸:
12"/300mm
年份:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BRUKER
D8 FABLINE
已驗證
類別
X-Ray
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
95109
晶圓尺寸:
12"/300mm
年份:
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
X-Ray Metrology配置
D8 FABLINE MH with TXS 1 High Brightness (2KW) Bruker Rotating Anode HB-TXS Spartan EFEM dual load port for 300mm wafers 2 Brooks Automation Automation software PTO from Peer Group 1 UMC 300 wafer stage with short tracks on primary side 1 Primary optics for micro diffraction, TXS X-ray system 1 LynxEye detector for secondary side + mount 1 Waferchuck 1 Pattern recognition software 1 Keyence laser triangulation module for fast height alignment 1 c.OEM 代工型號說明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.文檔
無文檔