描述
無描述配置
-AXIS Active Image Stabilisation -XiDAT 2.0 imaging chain -Up to 70 degree oblique angle views over the entire inspection area -Enhanced automated inspection routines -Automatic BGA and die-void measurements -Comprehensive data logging and reporting facilities -Uninterrupted rotating live oblique views 360 degrees around any point in the sampleOEM 代工型號說明
The Dage XD7600NT is an X-ray inspection system that provides oblique angle viewing of up to 70-degrees for any position 360-degrees around any point of the entire 18” x 16” (458 x 407 mm) inspection area allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices. It has a standard 2.0 mega pixel imaging system and can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints.文檔
無文檔
NORDSON / DAGE
XD7600NT
已驗證
類別
X-Ray / XRD / XRF
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114028
晶圓尺寸:
未知
年份:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NORDSON / DAGE
XD7600NT
類別
X-Ray / XRD / XRF
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114028
晶圓尺寸:
未知
年份:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
-AXIS Active Image Stabilisation -XiDAT 2.0 imaging chain -Up to 70 degree oblique angle views over the entire inspection area -Enhanced automated inspection routines -Automatic BGA and die-void measurements -Comprehensive data logging and reporting facilities -Uninterrupted rotating live oblique views 360 degrees around any point in the sampleOEM 代工型號說明
The Dage XD7600NT is an X-ray inspection system that provides oblique angle viewing of up to 70-degrees for any position 360-degrees around any point of the entire 18” x 16” (458 x 407 mm) inspection area allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices. It has a standard 2.0 mega pixel imaging system and can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints.文檔
無文檔