描述
Die Bonder配置
無配置OEM 代工型號說明
"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™. The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Bond Force Control System with Piezo Sensor Technology Advanced Low Friction Wire Feed System Fully Programmable BITS System Latest PC-based Processing Power Small Ball Detection Maxµm ultra Enhanced Performance UPH +10% over the Maxµm plus ±2.5µm Accuracy for 35µm Pitch Production Copper Wire Bonding Capable Wire Bonder文檔
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KULICKE & SOFFA (K&S)
Maxµm Ultra
已驗證
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
111795
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
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KULICKE & SOFFA (K&S)
Maxµm Ultra
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
111795
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Die Bonder配置
無配置OEM 代工型號說明
"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™. The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Bond Force Control System with Piezo Sensor Technology Advanced Low Friction Wire Feed System Fully Programmable BITS System Latest PC-based Processing Power Small Ball Detection Maxµm ultra Enhanced Performance UPH +10% over the Maxµm plus ±2.5µm Accuracy for 35µm Pitch Production Copper Wire Bonding Capable Wire Bonder文檔
無文檔