描述
無描述配置
無配置OEM 代工型號說明
"""High productivity bonder for low-to-medium pin count applications."" ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity: Interactive Programmable Look Ahead Vision to ease first time set-up Power Series Xpress Loop to help increase the productivity of short wire applications Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area 10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.""" Wire Bonder文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
120151
晶圓尺寸:
未知
年份:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
ConnX PLUS
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
120151
晶圓尺寸:
未知
年份:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
"""High productivity bonder for low-to-medium pin count applications."" ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity: Interactive Programmable Look Ahead Vision to ease first time set-up Power Series Xpress Loop to help increase the productivity of short wire applications Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area 10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.""" Wire Bonder文檔
無文檔