描述
Wafer balling配置
無配置OEM 代工型號說明
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
104327
晶圓尺寸:
未知
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
AT PREMIER
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
104327
晶圓尺寸:
未知
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer balling配置
無配置OEM 代工型號說明
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.文檔
無文檔