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描述
無描述配置
Automatic Ball Bonder 2.00” X 2.56” XY Bonding Area 0.8 to 2.0 mil Wire Diameter Bond Height Differential 0.080 in. Maximum Offset Between Highest First Bond and Lowest Second Bond Wire Cycle Time – 85 msec (Standard Loop) Loop Shape Options - User Selectable Standard/Low Loop/Worked Loop/Spider Loop/BGA 2 Loop/J-wire/Stitch/ Stand-off Stitch/Gold-Ball Bumping Maximum Wire Length 0.300 in. for Standard/Low Loop (Other Loop Shape Options May Increase/Decrease Maximum Wire Length) Automatic Magazine Handling System APPLIED INTELLIGENT SYSTEMS 640/266 VME Pattern Recognition System 1ea 3 ½” Floppy Disc DriveOEM 代工型號說明
The Model 8028 ball bonder and began to shift production capacity from the Model 8020 ball bonder.文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
93573
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KULICKE & SOFFA (K&S)
8028
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
93573
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Automatic Ball Bonder 2.00” X 2.56” XY Bonding Area 0.8 to 2.0 mil Wire Diameter Bond Height Differential 0.080 in. Maximum Offset Between Highest First Bond and Lowest Second Bond Wire Cycle Time – 85 msec (Standard Loop) Loop Shape Options - User Selectable Standard/Low Loop/Worked Loop/Spider Loop/BGA 2 Loop/J-wire/Stitch/ Stand-off Stitch/Gold-Ball Bumping Maximum Wire Length 0.300 in. for Standard/Low Loop (Other Loop Shape Options May Increase/Decrease Maximum Wire Length) Automatic Magazine Handling System APPLIED INTELLIGENT SYSTEMS 640/266 VME Pattern Recognition System 1ea 3 ½” Floppy Disc DriveOEM 代工型號說明
The Model 8028 ball bonder and began to shift production capacity from the Model 8020 ball bonder.文檔
無文檔