描述

Model: Bondjet BJ955. Bonding type: Ultrasonic wedge-wedge bonding. Operation: Fully automatic production mode, with semi-automatic programming, manual mode, setup, configuration, service, alarm management, and online help. Bond time: Freely programmable from 0.1 to 300 ms per interval. Axis repeatability: X/Y/Z precision up to 10 µm. Ultrasound generator: Digital generator with PLL phase-locked loop and 1 Hz frequency resolution. Ultrasound power stage: 100 W programmable. Touchscreen: 23-inch monitor. Memory/storage: 8 GB RAM, 120 GB SSD, 1000 GB hard drive. Application Highlights: Fine pitch capability. Freely programmable loop forms and loop lengths. Optional loop generator for complex loop shapes. Integrated non-destructive pull test for wire and ribbon. S-shape can be programmed relative to wire direction or component. Technical Specs: Electrical supply: 230V AC, single-phase, -10%, 50–60 Hz. Max power consumption: 1.85 kVA max, 0.65 kVA average. Machine dimensions, BJ955: 740 mm wide x 1484 mm deep x 1912 mm high. Working area, BJ955: X 305 mm, Y 410 mm, Z 42 mm, P-rotation 440°. Travel range, BJ955: X 327 mm, Y 471 mm, Z 64 mm, P -130° to 330°. Weight: approx. 1150 kg uncrated. Camera: CMOS, 1280 x 1024 pixels. Lighting: Programmable two-segment ring light, box light optional. Interface: Gigabit Ethernet, USB, HDMI, SMEMA, digital I/O, analog I/O, RJ45, Profibus optional. Compressed air: 0.6 to 1.0 MPa, clean and dry. Vacuum: 800 hPa.

配置

Included Configuration: HBK10 bond head with backcut active blade. 60 kHz transducer for BJ653/BJ931/BJ95x/BJ98x series. Mechanically prepared for integrated non-destructive pull test. Accessory box set for BJ95x/985 with HBK10 60 kHz, including basic accessory box and expansion box. Leica M50 stereo microscope with swing arm and illumination. E-Box software-supported camera system for optical display of wedge, wire guide, and knife. 5 x 7 vacuum chuck, complete. Assembled charging station. High US-power kit assembly set for BJ985/BJ959/BJ955 for RBK03X. Bond Head Options: HBK10: For aluminum, copper, and AlCu wire from 50 µm to 600 µm, material dependent. RBK03 copper backcut bond head: For copper wire from 300 µm to 600 µm. RBK03 ribbon frontcut: For ribbon from 250 µm x 25 µm up to 2000 µm x 400 µm.