描述
無描述配置
無配置OEM 代工型號說明
The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129089
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
TWIN EAGLE XTREME
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129089
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.文檔
無文檔