描述
Process: WIRE BONDER配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文檔
無文檔
ASM
EAGLE XTREME
已驗證
類別
Wire / Wedge / Ball Bonder
上次驗證: 24 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114850
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME
類別
Wire / Wedge / Ball Bonder
上次驗證: 24 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114850
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Process: WIRE BONDER配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文檔
無文檔