描述
無描述配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
76740
晶圓尺寸:
未知
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
ASM
EAGLE XTREME GOCU
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
76740
晶圓尺寸:
未知
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder文檔
無文檔